I. Tej yam tshwm sim tsis txaus Bonding Strength
1. Peeling: Plating npoo warp thiab tev tawm nyob rau hauv flakes, pom kev sib cais los ntawm lub substrate, tshwj xeeb tshaj yog pom nyob rau hauv cov ces kaum los yog kev nyuaj siab concentration. Kev tshuaj xyuas microscopic feem ntau nthuav tawm oxide txheej lossis impurities ntawm qhov sib txuas, nrog kev sib txuas ntawm lub zog qis dua li qub.
2. Delamination/Spalling: Thaum sib dhos, tuav, lossis siv, txawm tias muaj kev cuam tshuam me ntsis, khoov, lossis kev co tuaj yeem ua rau tag nrho cov nplooj ntawv tshem tawm, qhia tias muaj kev sib raug zoo heev. Thaum lub sijhawm ua haujlwm, qhov no yuav tshwm sim raws li qhov chaw lossis lub network-zoo li spalling, maj mam nthuav dav thiab ua rau kev ua haujlwm tsis ua haujlwm.
3. Latent Bonding Defects: Qhov saum npoo zoo li tsis zoo, tab sis kev tsom xam ntawm metallographic qhia pom micropores, microcracks, los yog delamination ntawm qhov sib txuas, qhia tias muaj feem cuam tshuam ntawm delamination. Qhov no yog ib txwm muaj nyob rau hauv workpieces uas tsis tau txais kev kho mob hydrogen embrittlement los yog tsis tiav pretreatment.
II. Cov Txheej Txheem Kev Ntsuas thiab Kev Txiav Txim Siab
1. Bending Test: Khoov lub chrome-plated pas nrig qauv rov 180℃raws ib tug axis nrog ib txoj kab uas hla sib npaug zos rau nws thickness kom txog rau thaum lub substrate tawg. Yog tias tev, tawg, lossis flaking ntawm plating tshwm sim ntawm qhov chaw khoov, qhov adhesion yog suav tias tsis tsim nyog. Txoj kev no yog tsim rau deformable workpieces xws li xov hlau thiab nyias -walled qhov chaw.
2. Kev Tshawb Fawb: Siv lub cuab yeej nyuaj, kos ib daim phiaj sib tshuam ntawm 1mm ntawm lub plating nto, nkag mus rau hauv lub substrate. Siv lub siab-sensitive nplaum daim kab xev thiab tshem tawm sai sai. Yog hais tias pom tseeb plating fragments ua raws li daim kab xev, los yog yog hais tias tsis tu ncua flaking tshwm sim ntawm daim phiaj kev sib tshuam, lub adhesion tsis zoo. Raws li GB / T 9286 tus qauv, qib 0 yog qhov zoo tshaj plaws (tsis muaj flaking), thiab qib 5 lossis siab dua yog qhov tsis tsim nyog.
3. Thermal Shock Test: Ua kom sov cov qauv mus rau kwv yees li 200℃thiab tuav nws ntawm qhov kub ntawd ua ntej sai sai rau hauv dej txias, rov ua dua lub voj voog 3 zaug. Yog hais tias blistering, tawg, los yog tev tawm tshwm sim nyob rau hauv lub txheej, nws qhia tau hais tias tsis zoo bonding stability nyob rau hauv thermal expansion thiab contraction kev nyuaj siab, tshwj xeeb tshaj yog haum rau cov khoom siv nrog loj sib txawv ntawm expansion coefficients.
4. Daim kab xev Traction Test: Muaj feem xyuam rau cov yas substrates los yog yooj yim deformable qhov chaw. Siab- daim kab xev nplaum nplaum yog txuas nrog rau txheej txheej, siv zog traction ruaj khov, thiab tom qab ntawd nws sai sai tev tawm. Yog hais tias lub txheej peels tawm nrog daim kab xev, nws qhia tias tsis txaus adhesion.
5. Indentation Method thiab Microscopic Observation: Ib lub pob zeb diamond indenter yog siv los siv cov khoom hnyav, thiab cov npoo ntawm qhov indentation raug soj ntsuam rau radial tawg lossis txheej txheej. Microscopic tsom xam ntawm lub interface morphology tuaj yeem txiav txim siab qhov kev sib raug zoo. Txoj kev no feem ntau yog siv rau hauv kev tshawb fawb txog kev tshawb fawb lossis siab -kev ntsuas qhov tseeb.
III. Lub hauv paus ua rau tsis txaus Bonding
1. Tsis tiav Pretreatment: Cov roj residual, oxide zaj duab xis, los yog tsis tiav degreasing nyob rau saum npoo tiv thaiv cov txheej los ntawm zoo anchoring lub substrate.
2. Passivation ntawm Undercoat: Piv txwv li, yog tias npib tsib xee plated ua ntej chromium, cov nickel txheej raug rau huab cua ntev heev thiab oxidizes, cuam tshuam rau kev sib txuas ntawm chromium txheej.
3. Cov txheej txheem electroplating txawv txav: ntau dhau tam sim no, qhov kub thiab txias hloov pauv, thiab ntau dhau ntawm chromium los yog impurity ions hauv cov tshuaj plating yuav ua rau tsis muaj zog deposition zoo.
4. Tsis kho hydrogen embrittlement: Thaum lub sij hawm electroplating txheej txheem, hydrogen evolution nkag mus rau hauv lub substrate. Yog tias qhov kev kho mob tshem tawm hydrogen ntawm 180-220℃tsis ua, nws tuaj yeem ua rau muaj kev ntxhov siab sab hauv, ua rau delamination tom qab.
