I. Diagnose qhov laj thawj:
Kev tshuaj xyuas qhov muag: Tshawb xyuas qhov chaw nrog lub iav magnifying. Bubbling, tev, lossis xim sib txawv yuav qhia tau tias tsis tiav degreasing lossis plating kua paug.
Kev ntsuas Thickness: Ntsuas thickness siv txoj kev sib nqus (rau steel substrates) los yog eddy tam sim no txoj kev (rau non-magnetic substrates). Thickness hauv qab 20μm yuav tsum tau replating.
Adhesion test: Perform a 180° bend or cross-cut test. A peeling area >5% qhia tias adhesion tsis zoo.
II. Kho cov kev daws teeb meem:
Kev puas tsuaj me me: So cov oxide txheej nrog tshuaj txhuam hniav, lossis siv WD-40 xeb inhibitor rau kev nkag mus thiab kev tiv thaiv.
Siv tus kws kho tshwj xeeb + polishing kom rov qab ci.
Kev puas tsuaj loj: Cov tshuab polishing los txo qhov roughness, los yog immersion nyob rau hauv cov tshuaj polishing tov.
Kev puas tsuaj loj: Kev kho ib nrab nrog txhuam plating, lossis tag nrho cov chromium tshem tawm thiab rov ua dua (kom paub txog kev pheej hmoo ntawm substrate deformation).
III. Txheej txheem optimization los tiv thaiv rov tshwm sim:
Kev kho deg: Ultrasonic degreasing + acid pickling activation (dilute hydrochloric acid rau hlau alloy). Anodic rov qab -kev kho electrostatic (30-35 A / dm², 0.5-2 min).
Cov ntsiab lus kev saib xyuas: Chromium anhydride / sulfuric acid piv 100: 1, activated carbon filtration kom tshem tawm cov organic impurities.
Cov txheej txheem kev khiav hauj lwm: Cathode activation nrog qis tam sim no (4-6 A / dm², 2-3 min), preheat lub workpiece.
