I. Txheeb xyuas qhov laj thawj ntawm qhov teeb meem
Kev tshuaj xyuas qhov muag: Tshawb xyuas qhov chaw nrog lub iav magnifying. Bubbling, tev, lossis xim sib txawv yuav qhia tau tias tsis tiav degreasing lossis plating kua paug.
Kev ntsuas Thickness: Ntsuas lub thickness siv txoj kev sib nqus (rau steel substrates) los yog eddy tam sim no txoj kev (rau non-magnetic substrates). Thickness hauv qab 20μm yuav tsum tau replating.
Adhesion test: Bending 180° or performing a cross-cut test. A peeling area >5% qhia tias adhesion tsis zoo.
II. Kho cov kev daws teeb meem
Kev puas tsuaj me me:
Kev kho polishing: So nrog chrome polishing compound thiab ib daim ntaub mos. Haum rau me ntsis khawb.
Kho xim: Txau los npog khawb, tab sis kev ua haujlwm tsis zoo.
Kev puas tsuaj loj:
Txhuam plating: kho thaj chaw, zoo adhesion thiab ceev ceev.
Chemical plating: Immersion kho, haum rau cov duab nyuaj.
Kev puas tsuaj loj:
Zuag qhia tag nrho chrome tshem tawm thiab rov ua dua: Lub voj voog ntev, nws yooj yim rau tev, substrate tuaj yeem deform.
Nqus electroplating: daws teeb meem xeb; kho qhov chaw tsis tshua muaj tev.
III. Txheej txheem Optimization los tiv thaiv rov tshwm sim
Kev kho deg: Ultrasonic degreasing + acid pickling activation (dilute hydrochloric acid rau hlau alloy).
Anodic rov qab -electroplating kev kho mob (30-35 A / dm², 0.5-2 min).
Plate Solution Maintenance: Chromium anhydride / sulfuric acid piv 100: 1, activated carbon filtration kom tshem tawm cov organic impurities.
Kev khiav hauj lwm txheej txheem: Cathode activation nrog qis tam sim no (4-6 A / dm², 2-3 min), preheat lub workpiece.
